Lam Research Corp. (NASDAQ:LRCX) At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. We recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible. Ready to help define the future of technology? Join us: www.lamresearch.com/careers
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Columns5| Company | Markets | New markets | Momentum | Activity | Expansion score |
|---|---|---|---|---|---|
 Lam ResearchYou | 12 | 3 | +57% | 190 | 41 |
Process Engineer (all genders)
View postingVillach, Carinthia, Austria · yesterday
Field Service Engineer 2
View postingHsinchu Metropolitan Area · yesterday
Program/Project Manager 5
View postingBatu, Selangor, Malaysia · yesterday
Advanced packaging is becoming a crucial lever for AI system performance, power efficiency, and integration at scale. At #ECTC2026, Lam Research will share perspectives on how hardware equipment intelligence and process innovations in advanced packaging are evolving to support next gen AI infrastructure. Join Lam speakers Prahalad and Chee Ping Lee as they discuss emerging challenges and strategic opportunities across heterogeneous integration, advanced interconnects, and packaging architectur ...
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Electronic Components and Technology Conference
ActiveIBM introduces world's first sub-1nm chip with revolutionary nanostack 3D architecture, packing 100 billion transistors, offering 50% more performance or 70% energy efficiency than 2nm chips.
IBM announces breakthrough sub-1nm chip technology at 0.7nm using innovative 3D Nanostack architecture, integrating 100 billion transistors with 50% performance boost and 70% energy efficiency improvement over 2nm chips.
US semiconductor ETF SMH surged 6.78% as Trump canceled Iran airstrikes. AI chip, memory, and equipment stocks rallied, leading Nasdaq to its best day since April 8.
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