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Columns5| Company | Markets | New markets | Momentum | Activity | Expansion score |
|---|---|---|---|---|---|
均胜集团有限公司You | 0 | 0 | — | 0 | 0 |
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BlackSesame Technologies unveiled new chip platforms and partnerships at Auto Shanghai 2025, showcasing innovations in assisted driving and cockpit-driving integration.
BlackSesame, Dongfeng, and Joyson announce mass production of integrated cockpit solution based on BlackSesame's Wudang C1296 chip, set for 2025 launch in multiple Dongfeng models.
BlackSesame showcases AI innovations in assisted driving, embodied intelligence, and consumer electronics at CES 2026, expanding its global presence.
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