Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world’s top 100 best-managed companies. Cadence solutions offer limitless opportunities—learn more at www.cadence.com.
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|---|---|---|---|---|---|
 CadenceYou | 14 | 1 | -41% | 51 | 36 |
Contracts Program Manager
View postingBrussels, Brussels Region, Belgium · yesterday
Contracts Program Manager
View postingWarsaw, Mazowieckie, Poland · yesterday
Principal Product Engineer
View postingHsinchu City, Taiwan, Taiwan · Full-time · yesterday
Artificial Intelligence is redefining data center design — increasing power demands, driving liquid cooling adoption, and enabling digital twins for smarter operations. 📘 Get your free copy of our new ebook: The Impact of AI on Data Center Design#AI #DataCenter #LiquidCooling #DigitalTwin ...
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At #COMPUTEX2026, Cadence unveils the industry’s first fully autonomous virtual engineer for chip design. With the Level-5 ChipStack AI Super Agent, we’re moving beyond AI assistance to true autonomy—enabling systems that plan, implement, and optimize complex design and verification workflows. Powered by Cadence’s physics-based engines and built with NVIDIA Nemotron and NVIDIA OpenShell secure runtime, this breakthrough delivers: ✅ Up to 40X faster RTL validation ✅ From weeks to less than a day ...
EndedCadence's new Dynamic Power Analysis app enables engineers to analyze billion-gate AI chip designs within hours, achieving 97% accuracy in power estimation.
Alcor Micro showcases Mobius100 CPU for AI and HPC at OCP Summit, featuring Arm CSS V3 architecture and PQC security.
Cadence unveils AI 'Super Agent' to revolutionize chip design and verification, promising 10x productivity boost in front-end silicon processes.
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